Chinese technology giant Huawei has reportedly developed its own chip design tools as a way to sidestep U.S. sanctions.
China's financial and business publication Yicai obtained an interview with Huawei's rotating chairman Eric Xu that claimed the company and other domestic firms jointly developed a tool for designing semiconductors at 14 nanometers and higher.
These tools will be verified this year, which will enable them to be used.
Trade Algo was unable to reach Huawei for comment immediately.
If Xu's allegations are accurate, Huawei would have made a move to lessen its reliance on US semiconductor technology. American companies, including Synopsys and Cadence Design Systems, dominate the semiconductor design tool market.
Washington, however, cut Huawei off from US chipmaking equipment in 2020 through penalties, which severely hampered the Chinese technology giant's smartphone sector.
Design tools for semiconductors larger than 14 nanometers were mentioned in Xu's speech. Each transistor on a chip is a specific size, measured in nanometers. More transistors can be crammed onto a single semiconductor with decreasing transistor size. Chips can typically get more potent and effective when nanoscale size is decreased.
Nevertheless, 14-nanometer chips lag behind the most recent smartphone technology by several generations. Apple's iPhone 14 Pro Max, for instance, employs a processor with a 5 nm size. Yet, some of the company's other products might use 14-nanometer processors.
When asked by Trade Algo how effective Huawei's design tools are, Pranay Kotasthane, director of the Takshashila Institution's high-tech geopolitics program, said he would like to see more information.
Kotasthane outlined how semiconductor design firms collaborate with contract chip manufacturing companies to produce a collection of files known as a Process Design Kit. The fundamental parts of a chip are "modeled" by this PDK in terms of their "physical and electrical characteristics." To assure the best yield of semiconductors, the design firm and manufacturer must go through a procedure to optimize production. According to Kotasthane, "chip designs will fail when transformed into silicon" if this process is not carried out.
“Electronic design automation (EDA) businesses from China have not yet sufficiently proven themselves,” according to Kotasthane.
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